IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
€302.00
IEC 60050-521:2002/AMD1:2017 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
€12.00
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
€23.00
IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
€389.00
IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
€46.00
IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
€186.00
IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
€133.00
Semiconductor devices - Discrete devices and integrated circuits - Part 2: Rectifier diodes (IEC 60747-2:2000)
€145.14
IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2: Dimensions
€551.00
IEC 60796-1:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 1: Functional description with electrical and timing specifications
IEC 60796-2:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 2: Mechanical and pin descriptions for the system BUS configuration, with edge connectors (direct)
IEC 60796-3:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors
IEC 60191-2T:1996 Eighteenth supplement
IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
IEC 60191-2V:1998 Twentieth supplement
