Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Measuring methods package dimensions small J-lead packages (SOJ)
€193.00
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Measuring methods package dimensions small packages (SOP)
Semiconductor devices. Mechanical and climatic test methods Board level drop method using a strain gauge
€269.00
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Environmental testing. Test methods Tests. M. Low air pressure
€165.00
Discrete semiconductor devices and integrated circuits. Semiconductor devices. sensors Hall elements
Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures
Data requirements for semiconductor die. Particular and recommendations die types Bare
Data requirements for semiconductor die. Specific and recommendations Test quality
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
Connectors for electronic equipment. Tests and measurements. Electrical continuity contact resistance tests Test 2f. Housing (shell) electrical
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
€374.00
Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c.
€355.00
Low voltage surge protective devices Specifications for avalanche breakdown diode (ABD)
Data requirements for semiconductor die. Exchange data formats and dictionary
