Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
€193.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
Semiconductor devices. Mechanical and climatic test methods General
€165.00
Low voltage surge protective devices Specification for thyristor suppressors (TSS)
€374.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
Discrete semiconductor devices and integrated circuits. Optoelectronic Essential ratings characteristics
€316.00
Discrete semiconductor devices and integrated circuits. Optoelectronic Measuring methods
€355.00
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions ball grid array (BGA)
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
Data requirements for semiconductor die. Particular and recommendations die types Minimally-packaged
Semiconductor devices. Mechanical and climatic test methods Low air pressure
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased autoclave
