Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/1591/CD:2001)
€84.58
Semiconductor devices - Mechanical and climatic test methods - General (IEC 47/1571/CDV:2001); German version prEN 60749-1:2001
€41.78
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023.
€98.32
Semiconductor devices - Recommendations for data sheets - Voltage reference and voltage regulator diodes
€24.39
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors (IEC 47E/320/CD:2007)
€190.65
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
€122.34
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007)
€91.03
Semiconductor devices - Discrete devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/326/CD:2007)
€69.91
Hot Carrier Test on MOS Transistors (IEC 47/1902/CD:2007)
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
€105.42
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 47E/337/CD:2007)
€48.79
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)
€116.64
Time Dependent Dielectric Breakdown Test (TDDB) for Inter-metal layers (IEC 47/1946/CD:2007)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
