Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data - Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 3 : Données.
€95.67
Semiconductor devices - Part 16-6 : microwave integrated circuits - Frequency multipliers
€116.50
Semiconductor devices - Part 17 : magnetic and capacitive coupler for basic and reinforced insulation
€166.33
Semiconductor devices - Mechanical and climatic test methods - Part 41 : standard reliability testing methods of non-volatile memory devices
€111.67
Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
€98.42
Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
€85.42
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
€77.67
Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43 : Directives concernant les plans de qualification de la fiabilité des CI
€138.00
General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions - Eclairage général - Produits à diode électroluminescente (LED) et équipements associés - Termes et définitions
€43.67
Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films - Dispositifs à semiconducteurs
€126.00
Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing
Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : Résistances des CMS à boîtier plastique à l'effet combiné de l'humidité et de la chaleur de brasage
Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices
Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
€59.33
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications
