Dispositifs à semi-conducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasageAutomatic translation from French : Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packaging, labeling and transportation of surface mount components sensitive to the combined effect of humidity and soldering heat
€125.00
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005); German version EN 60749-30:2005.
€77.20
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003.
€91.03
Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004.
€140.00
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004); German version EN 60749-23:2004.
Blank detail specification - Phototransistors, photodarlington transistors, phototransistor arrays; German version EN 120003:1992
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996
€134.02
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2002); German version EN 60749-18:2003.
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2003); German version EN 60749-5:2003.
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003.
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003.
