Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
€86.33
Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure - Dispositifs à semiconducteurs
€59.33
Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock - Dispositifs à semiconducteurs
€56.33
Semiconductor devices - Mechanical and climatic test methods - Part 11 : rapid change of temperature - Two-fluid-bath method - Dispositifs à semiconducteurs
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
€54.50
Semiconductor devices - Mechanical and climatic test methods - Part 1 : general - Dispositifs à semiconducteurs
€42.67
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
€95.67
Semiconductor devices - Mechanical and climatic test methods - Part 16 : particle impact noise dectection (PIND) - Dispositifs à semiconducteurs
Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state - Dispositifs à semiconducteurs
€43.67
Semiconductor devices - Mechanical and climatic test methods - Part 17 : neutron irradiation - Dispositifs à semiconducteurs
Semiconductor devices - Mechanical and climatic test methods - Part 18 : ionizing radiation (total dose) - Dispositifs à semiconducteurs
€91.00
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals
€53.67
Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
€60.85
