IEC 63284:2022 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors
€93.00
IEC 63275-2:2022 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation due to body diode operation
€46.00
IEC 62007-1:2015/AMD1:2022 Amendment 1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
€12.00
IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
€186.00
IEC 61975:2010/AMD2:2022 Amendment 2 - High-voltage direct current (HVDC) installations - System tests
€23.00
IEC 60747-16-7:2022 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
€342.00
IEC 60747-16-8:2022 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
€302.00
IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
IEC 63287-2:2023 Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
IEC 60749-5:2023 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 61954:2021/COR1:2024 Corrigendum 1 - Static VAR compensators (SVC) - Testing of thyristor valves
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003.
€77.20
Semiconductor devices - Part 3: Signal (including switching diodes) and regulator diodes (IEC 47E/395/CD:2010)
€157.10
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010.
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010.
